Intel, Micron Achieve Industry’s Most Efficient NAND Product Using 3-Bit-Per-Cell Technology
Submitted By Steven on Aug 11 2009 at 11:02 AM
Intel Corporation and Micron Technology Inc. today announced the development of a new 3-bit-per-cell (3bpc) multi-level cell (MLC) NAND technology, leveraging their award-winning 34-nanometer (nm) NAND process. The chips are typically used in consumer storage devices such as flash cards and USB drives, where high density and cost-efficiency are paramount.
OCZ Technology Announces the Latest XTC Memory Cooler to Enhance the Performance of Overclocking Modules
Submitted By Steven on Jun 16 2009 at 6:42 AM
OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory and computer components, today unveiled the latest memory cooling accessory, the OCZ XTC (Xtreme Thermal Convection) Cooler Revision 2 to promote dedicated airflow to modules. Active cooling combined with passive thermal solutions is extremely important in any rigorous overclocking environment, and OCZ developed the next generation XTC Cooler for supreme heat management of OCZ’s complete lineup of high-speed RAM.
A-DATA XPG DDR3 Memory Breaks A New World Record
Submitted By Steven on Jan 22 2009 at 10:57 AM
A-DATA® Technology Co., Ltd., a worldwide leading manufacturer in high performance memory products, announced today that its XPG™ DDR3 memory modules have broke a new world record on SuperPi 32m. The record was set by utilizing the DFI Lanparty UT X58 motherboard and XPG X Series v2.0 memory, the DDR3-2133X v2.0 2GBx3 triple-channel kit.
The SuperPi 32m record of 6min 40sec 360ms was achieved at a speed of 2237 MHz and latency settings of 8-7-7-21 using DDR3-2133X v2.0 2GBx3 triple-channel kit.
Elpida Completes Development of 50nm Process DDR3 SDRAM
Submitted By steven on Nov 26 2008 at 5:27 PM
Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has completed development of a 50nm process DDR3 SDRAM. The new DRAM product features the lowest power consumption in the industry, 2.5Gbps ultra high speed and a 1.2V low voltage operation based on the industry's smallest chip size.
The new 50nm process DDR3 SDRAM was developed using the industry's most advanced 193nm (ArF) immersion lithography technology and copper interconnect technology and has a chip size of less than 40mm2. Also, the new SDRAM is an eco-friendly DRAM. It operates on not only DDR3 standard 1.5V supply voltage but even lower voltages of 1.35V and 1.2V and contributes to the low-power operations of high-density memory systems such as servers and data centers.
Super Talent Launches SSDs for Asus Eee PCs
Submitted By steven on Oct 8 2008 at 12:52 PM
Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a new line of mini PCI-Express SSDs, available in 16GB, 32GB and 64GB capacities, that were designed explicitly for the Asus Eee PC.
